Each diamond segment is laser-welded to withstand demanding applications. Production Process: Laser welded. Size: Complete diameter range for your choice. MOQ: It's upon the package type and size. Package: Paper box, etc.. Dry cutting. Application: Universal for general building materials, masonry, concrete, fast drilling progress with good service life.

Chip-free drilling, quickly and easily cut holes. Production Process: Electroplated. Size: Complete diameter range for your choice. MOQ: It's upon the package type and size. Package: Double blister card, plastic tube, paper box, etc.. Wet cutting. Application: Glass, marble, ceramic tile, porcelain, etc..

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